新疆11选5 开奖号码

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                 > Products & Solution > Grinding & polishing

                This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.

                 

                PRINCIPLES OF EQUIPMENT:

                The upper and lower grinding discs rotate in opposite directions.The movement of the workpiece is both revolutionary and self-rotating.Both sides are evenly grounded,the grinding resistance is small and does not damage the workpiece.

                 

                MAIN FEATURES:

                ·The main structure of the machine adopts a one-time forming process, and the reasonable structure greatly improves the rigidity of the machine.

                ·Set each relevant parameter directly through the touch screen.The LCD touch screen displays the current working state and related setting parameters in real time.The system provides 500 data storage.Menu-style operation is convenient and quick.

                ·Stepless variable frequency for speed-regulating, stable start&stop without impact. The upper and lower grinding discs are equipped with a fast rise and fall, a slow rise and a slow down function.Effectively reduce product scrap rate.

                ·Efficient and stable transmission system which with helical gear has low noise.

                ·Upper grinding disc automatically leveling,Effectively solve the wrong disk problem.The upper grinding disc has self-locking function,further improvement in safety performance.

                ·Reduce center gear diameter and increase processing area, Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.Save energy while improving production efficiency.

                ·The sun gear and the inner ring gear move synchronously,meeting the requirements of picking and placing workpieces and adjusting the meshing position of the carrier.

                ·Fully lubricated the opposite moving surfaces with a centralized lubrication system.

                 

                型号Model

                单位Unit

                设计值

                研磨盘尺寸Plate size

                mm

                1053*530*45

                最小研磨厚度Min.workpiece thickness

                mm

                0.4

                游星轮片数量Number of carriers

                7片(柱销式)

                最大研磨新疆11选5开奖结果爱彩乐直径Max. Workpiece diameter

                mm

                Φ280

                下磨新疆11选五爱彩乐盘转速Lower plate rotational speed

                rpm

                2-45(无极调速)(Stepless change speed)

                加新疆11选5开奖信息工件精度Machined work piece precision

                在来料平行新疆11选五5开奖结果手机版度0.005以内时保证平行度0.005,表面粗糙度不

                大于Ra0.15μm,抛光件Ra0.125μm

                The parallelism is 0.005 when the parallelism of the

                incoming material is 0.005, the surface roughness is not more than Ra0.15μm, the polishing piece Ra0.125μm

                主电机Main motor power

                380V/15Kw/1450rpm

                下研磨盘跳动Lower plate run out

                mm

                0.05

                修正轮新疆11远5连线走势图修正平行度Correction wheel correction parallelism

                mm

                0.005

                外形尺寸Overall dimension

                mm

                1800*1400*2680

                机器重量Machine weight

                Kg

                3200